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Bonded Versus Loose Diamond Abrasion

Domenii publicaţii > Stiinte ingineresti + Tipuri publicaţii > Articol în volumul unei conferinţe

Autori: Dr. Ioan D. Marinescu, Dr. Christian E. Spanu, Dr. Michael Hitchiner

Editorial: International Conference on Precision Engineering 2003/04, 2004.

Rezumat:

Surface finish, material removal rate, and geometrical characterization of the surface are assessed and compared after machining identical aloxide (Al2O3) ceramic workpieces with bond diamond (double side grinding operation), and loose diamond (lapping operation), in comparable conditions of load per grain and average grain size. The results showed that bonded abrasive grinding produces comparable surface quality and higher material removal rates in less machining time as compared to loose abrasive process.

Cuvinte cheie: rectificare, lepuire, materiale ceramice // grinding, lapping, ceramic materials

URL: http://www.simtech.a-star.edu.sg/events/icope_2/Default.htm