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Role of thiourea additive in the electrodeposition process of nanocrystalline nickel and iron thin films

Domenii publicaţii > Chimie + Tipuri publicaţii > Articol în revistã ştiinţificã

Autori: Nicolae Sulitanu, Ion Sandu, Ioan-Gabriel Sandu

Editorial: Syscom, Rev. Chim., 54, p.670-675, 2003.

Rezumat:

Lucrarea se prezinta procesul de incorporare a sulfului in filmele subtiri de nichel si fier prin electroliza in bai ce contin tiouree ca aditiv, aceasta din urma conducand la micsorarea granulelor de cristal. Atomii de sulf pot fi incorporati in clusteri metalici la interfata cristalitelor. The paper deals with the process of sulphur incorporation in thin films of nickel and iron obtained by electrolysis in baths containing thiourea as an additive, which leads to a decrease in crystalline grain size. The sulphur atoms may be incorpored in a metallic cluster at the crystallites interface similar to a grain boundaries.

Cuvinte cheie: materiale nanocristaline, aliaje nichel-sulf si fier-sulf, straturi subtiri, rate de electrodepunere // nanocrystalline materials, nickel-sulphur, iron-sulphur alloys, thin films, electrodeposition rate